发明名称 COMPOSITION FOR FORMING UPPER LAYER FILM AND RESIST PATTERN FORMING METHOD USING SAME
摘要 [Problem] To provide: a composition for forming an upper layer film, which enables the formation of a pattern that has excellent roughness and pattern shape in a pattern forming method by means of extreme ultraviolet light exposure; and a pattern forming method which uses this composition for forming an upper layer film. [Solution] A composition for forming an upper layer film, which is characterized by containing a triphenylene derivative having a hydrophilic group and a solvent; and a method wherein a pattern is formed by applying this composition to a resist surface and then exposing and developing this composition. This composition may additionally contain a polymer.
申请公布号 WO2014142296(A1) 申请公布日期 2014.09.18
申请号 WO2014JP56858 申请日期 2014.03.14
申请人 AZ ELECTRONIC MATERIALS MANUFACTURING (JAPAN) KK 发明人 WANG XIAOWEI;OKAYASU TETSUO;PAWLOWSKI GEORG;KINUTA TAKAFUMI
分类号 G03F7/11;C08F20/10;C08G63/133;H01L21/027 主分类号 G03F7/11
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