| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the amount of wiring for connecting a semiconductor chip to an electrode terminal can be increased in a limited region.SOLUTION: The semiconductor device comprises: a semiconductor chip 14; a chip mounting substrate 12 having a chip mounting surface 12a on which the semiconductor chip 14 is mounted; and an electrode terminal 20 which is electrically connected to the semiconductor chip 14 through a first wiring 22a and a second wiring 22b. The second wiring 22b is connected to the first wiring 22a in an overlapping manner on at least one of the semiconductor chip 14 and the electrode terminal 20. |
