发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve problems in which a DC-DC converter is broken due to the influence of heat generation from a device, which is assumed to be caused by arranging the DC-DC converter on a burn-in board, the number of devices mountable on the burn-in board is limited, and so on.SOLUTION: In a step of performing an acceleration test of a semiconductor package: for a first semiconductor package, a first power supply supplied from a power supply board to a burn-in board via an extension board is used; and for a second semiconductor package having larger current consumption than the first semiconductor package and having low operation voltage, a second power supply into which the first power supply is converted by a power supply conversion component such as a DC-DC converter mounted on the extension board is used.
申请公布号 JP2014169964(A) 申请公布日期 2014.09.18
申请号 JP20130042850 申请日期 2013.03.05
申请人 RENESAS ELECTRONICS CORP 发明人 SATO KOJI ; KIYOFUJI AKIRA
分类号 G01R31/26;G01R31/28 主分类号 G01R31/26
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