Inductor With Magnetic Material

摘要

In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die comprises a first metallization layer, and the first metallization layer comprises a first conductive pattern. The interposer comprises a second metallization layer, and the second metallization layer comprises a second conductive pattern. Some of the conductive bumps electrically couple the first conductive pattern to the second conductive pattern to form a coil. A magnetic layer is positioned within the coil. In another embodiment, a coil is formed on a single substrate, wherein a magnetic layer is positioned within the coil. Other embodiments contemplate other configurations of coils, inductors, and/or transformers, and contemplate methods of manufacture.

主权项

1. A semiconductor device, comprising:
a semiconductor die comprising a first metallization layer, the first metallization layer comprising a first conductive pattern; an interposer comprising a second metallization layer, the second metallization layer comprising a second conductive pattern; and conductive bumps bonding the semiconductor die to the interposer, some of the conductive bumps electrically couple the first conductive pattern to the second conductive pattern to form a coil, the coil having a magnetic layer positioned within.