发明名称 SUBSTRATE COATING TECHNIQUES
摘要 According to certain techniques, a system for coating a substrate includes a preparation component, a coating component, and a curing component. The preparation component includes a plasma applicator that irradiates the substrate with plasma to form a prepared substrate. The coating component coats the prepared substrate with a coating medium to form a coated substrate. The coating component includes a coating head that receives the coating medium from a reservoir and applies the coating medium to the prepared substrate to form the coated substrate. The coating component includes a vacuum that removes an excess amount of the coating medium from the coated substrate. The curing component includes at least one ultraviolet emitter and irradiates the coated substrate with ultraviolet energy to form a cured substrate.
申请公布号 US2014272107(A1) 申请公布日期 2014.09.18
申请号 US201313841623 申请日期 2013.03.15
申请人 ARMOUR KOATINGS LLC 发明人 Spielman Ronald;Neely Jon A.;Lyell Dennis N.
分类号 B05C11/10;B05D3/12 主分类号 B05C11/10
代理机构 代理人
主权项 1. A system for coating a substrate, wherein the system comprises: a coating chamber configured to accommodate the substrate; a first coating medium input port configured to receive a first coating medium from a first coating reservoir; a first interchangeable cartridge configured to retain the first coating medium; a coating head including an aperture, wherein the coating head is configured to: receive the first coating medium from the first coating medium input port,receive the first coating medium from the first interchangeable cartridge, andpass the first coating medium through the aperture towards the coating chamber; a vacuum head including an aperture and configured to receive an excess amount of the first coating medium from the coating chamber through the aperture; and wherein the first interchangeable cartridge is configured to: receive an excess amount of the first coating medium from the coating chamber, andrecirculate the first coating medium to the coating head.
地址 Chicago IL US