| 发明名称 |
LED MODULE |
| 摘要 |
The invention relates to a light-emitting diode arrangement having the following: a preferably heat-conductive substrate (2); a printed circuit board (5) which is arranged on the substrate (2), a recess (9) being provided in the printed circuit board (5); and at least one light-emitting diode chip (3) which is arranged on the substrate (2) and in the recess (9), said recess (9) being at least partly filled with at least one matrix material which preferably has a color-converting material (8). |
| 申请公布号 |
US2014264406(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201214358332 |
申请日期 |
2012.11.15 |
| 申请人 |
TRIDONIC GmbH & CO KG |
发明人 |
Muehlbacher Gerd;Kerber Stefan;Brydon Gavin |
| 分类号 |
H01L25/075;H01L33/58;H01L33/64;H01L33/50 |
主分类号 |
H01L25/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting diode (LED) arrangement, comprising:
a metallic, thermally conductive carrier (2), a printed circuit board (5) arranged on the carrier (2), wherein a cutout (9) is provided in the printed circuit board (5), at least one light-emitting diode chip (3) which is arranged on the carrier (2) and in the cutout (9) and is electrically contact-connected to the printed circuit board, wherein the cutout (9) is at least partly filled with at least one matrix material comprising a color conversion material (8). |
| 地址 |
Sombirn AT |
