| 发明名称 |
Semiconductor Package with Top-Side Insulation Layer |
| 摘要 |
A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound encapsulates the die, the connector, at least part of the base, and part of the lead, so that the lead extends outward from the mold compound. An electrical insulation layer separate from the mold compound is attached to a surface of the mold compound over the connector. The electrical insulation layer has a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector. |
| 申请公布号 |
US2014264944(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313803255 |
申请日期 |
2013.03.14 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Otremba Ralf;Schredl Jürgen;Peinhopf Wolfgang;Brucchi Fabio;Höglauer Josef |
| 分类号 |
H01L23/28;H01L23/48;H01L23/00 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a base; a die attached to the base; a lead; a connector electrically connecting the lead to the die; a mold compound encapsulating the die, the connector, at least part of the base, and part of the lead so that the lead extends outward from the mold compound; and an electrical insulation layer separate from the mold compound and attached to a surface of the mold compound over the connector, the electrical insulation layer having a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector. |
| 地址 |
US |
