| 发明名称 |
3D Shielding Case and Methods for Forming the Same |
| 摘要 |
A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh. |
| 申请公布号 |
US2014262475(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313926938 |
申请日期 |
2013.06.25 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liu Monsen;Wang Chuei-Tang;Chih Lai Wei;Yu Chen-Hua |
| 分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a metal shield case comprising:
a first metal mesh; anda Through-Assembly Via (TAV) over the first metal mesh, wherein the TSV forms a ring, and wherein the TAV and the first metal mesh are electrically interconnected and electrically grounded. |
| 地址 |
Hsin-Chu TW |
