| 发明名称 |
ELECTRONIC APPARATUS AND COOLING METHOD |
| 摘要 |
A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system includes a pipe through which a cooling medium to cool the electronic component flows; a metal member configured to be coupled with an outer surface of the pipe; a Peltier device configured to cool the metal member to a temperature lower than a temperature of the outer surface of the pipe; a detector that detects dew condensation of outer air occurring on the metal member; and a processor that lowers the temperature of the cooling medium, and stops lowering a temperature of cooling medium when the occurrence of dew condensation of outer air on the metal member is detected. |
| 申请公布号 |
US2014260328(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201314134509 |
申请日期 |
2013.12.19 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KUBOTA Jumpei |
| 分类号 |
H05K7/20;B23P15/26 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system comprising:
a pipe through which a cooling medium to cool the electronic component flows; a metal member configured to be coupled with an outer surface of the pipe; a Peltier device configured to cool the metal member to a temperature lower than a temperature of the outer surface of the pipe; a detector that detects dew condensation of outer air occurring on the metal member; and a processor that lowers the temperature of the cooling medium, and stops lowering a temperature of cooling medium when the occurrence of dew condensation of outer air on the metal member is detected. |
| 地址 |
Kawasaki-shi JP |
