| 摘要 |
The inlay has a planar substrate layer on which an antenna is arranged with end sided flat conductive pads (4, 5) for connecting a chip. The conductive pads are provided from a textile fabric (6) with yarn crossings (7). An electrically conductive contact region (10) is provided at an upper side of the textile fabric. The conductive contact region is provided with a three-dimensional conductive pad structure with a set of binding points of the textile fabric, where the pad structure comprises increased topographic contact zones (11). |
