| 摘要 |
A package and a method of making the package are provided. A package, according to an embodiment, includes an integrated circuit supporting a conductive pillar; a substrate having a landing pad on each embedded metal trace, wherein width of the landing pad is greater than that of a corresponding embedded metal trace; and a conductive material electrically coupling the conductive pillar to the landing pad. In an embodiment, the landing pad overlaps the metal trace in one direction. |
