Chip package connector assembly

摘要

This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board 106 including a plurality of circuit board contacts. The chip package assembly may include a chip package 102 including a first side 118 and a second side 120, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly 122.