| 摘要 |
According to an embodiment of the present invention, a light emitting device package includes: a light emitting device having a plurality of electrode parts; and a substrate that has a junction area on which the light emitting device is mounted and includes a plurality of electrode pads which are each electrically connected to the electrode parts. A portion of the electrode pads in the junction area may be removed so as to form an opening, which exposes the substrate. |
