| 摘要 |
The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt% of Ag, 0.3 to 1.5 wt% of Cu, 0.01 to 0.2 wt% of Ni, 1.0 wt% or less of Ga, and the balance being Sn and unavoidable impurities. |
