发明名称
摘要 Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.
申请公布号 JP5591223(B2) 申请公布日期 2014.09.17
申请号 JP20110507684 申请日期 2009.05.01
申请人 发明人
分类号 H01L21/26 主分类号 H01L21/26
代理机构 代理人
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