| 发明名称 |
Apparatus for electronic assembly with improved interconnect and associated methods |
| 摘要 |
An apparatus includes a substrate that includes electronic circuitry. The apparatus further includes a first die that includes electronic circuitry, and at least one shielded interconnect. The shielded interconnect(s) couple(s) electronic circuitry in the substrate to electronic circuitry in the first die. |
| 申请公布号 |
EP2779226(A1) |
申请公布日期 |
2014.09.17 |
| 申请号 |
EP20140158359 |
申请日期 |
2014.03.07 |
| 申请人 |
ALTERA CORPORATION |
发明人 |
LIU, HUI;SHI, HONG;XIE, YUANLIN;JIANG, XIAOHONG |
| 分类号 |
H01L23/13;H01L23/498;H01L23/552 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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