| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball repair device capable of putting a solder ball which has not been put or which is put as an alternative solder ball of a vanished solder ball easily on a substrate, in which a head comprising solder ball pick up parts and flux dotting parts on both sides of the head rotates.SOLUTION: The solder ball repair device comprises: a head transportation part 110 transported horizontally along a fulcrum on an upper part of a substrate 200; and a head part 120 disposed on the head transportation part 110 and driving and rotating through a rotation axis 130, picking up a solder ball from the head transportation part 110 during rotation of the rotation axis 130, and putting the solder ball into a position where a solder ball vanished on the substrate 200. |
