| 摘要 |
<p>#CMT# #/CMT# The method involves manufacturing two attachment areas (2) on a connection carrier (1) and bringing soldering material into the attachment areas. Another connection carrier is applied on the attachment areas and is dispersed on the former connection carrier with the soldering material within the attachment areas. The attachment area is manufactured by producing a recess in the former connection carrier and a metallization is applied on the former connection carrier. #CMT# : #/CMT# An independent claim is also included for an arrangement of optoelectronic components comprising a connector carrier, which has two attachment areas. #CMT#USE : #/CMT# Method for the production of an arrangement of optoelectronic components. #CMT#ADVANTAGE : #/CMT# The method involves manufacturing two attachment areas on a connection carrier and bringing soldering material into the attachment areas. The attachment area is manufactured by producing a recess in the former connection carrier and a metallization is applied on the first connection carrier, and hence enables to provide economically feasible arrangement of optoelectronic elements. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic perspective view of a connection carrier. 1 : Connection carrier 2 : Attachment areas 7 : Conductive strips 8 : Connection points.</p> |
