| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which efficiently dissipates heat generated in a resistive element, and a method of manufacturing the wiring board. SOLUTION: The wiring board includes the resistive element, an insulating layer formed in contact with the resistive element, a wiring layer for electric conduction electrically connected with the resistive element, and a wiring layer for heat dissipation which dissipates the heat generated in the resistive element. The insulating layer is provided with a via hole which is formed so as to expose the resistive element, and a recess which is formed so as not to expose any resistive element, with a bottom thereof opposed to the resistive element. The wiring layer for electric conduction is arranged in the via hole. The wiring layer for heat dissipation is arranged in the recess. COPYRIGHT: (C)2010,JPO&INPIT |
