FABRICATION METHODS OF THERMOELECTRIC THIN FILM MODULES USING ADHESIVE FLIP CHIP BONDING AND THERMOELECTRIC THIN FILM MODULES PRODUCED USING THE SAME METHOD

摘要

The present invention relates to a thermoelectric thin film module. In particular, the present invention provides: a method for manufacturing the thermoelectric thin film module whereby thermoelectric thin film legs are bonded by flip chips using an anisotropic conductive adhesive or nonconductive adhesive so as to prevent defection of the module and to increase properties and reliability of the module; and the thermoelectric thin film module manufactured by the same method.