FABRICATION METHODS OF THERMOELECTRIC THIN FILM MODULES USING MOULDS CONSISTING OF VIA-HOLES AND THERMOELECTRIC THIN FILM MODULES PRODUCED USING THE SAME METHOD

摘要

The present invention relates to a thermoelectric thin film module. In particular, the present invention provides a method for manufacturing a thermoelectric thin film module and the thermoelectric thin film module manufactured by the same. According to the method, the thermoelectric thin film module is manufactured by forming n-type thermoelectric thin film legs and p-type thermoelectric thin film legs with a mold having via-holes so as to simplify a manufacturing method and to enhance properties and reliability of the module.