发明名称 High thermal conductive radiation adhesive tape and High thermal conductive radiation adhesive commodities containing the same
摘要 The present invention relates to a high thermal conductive radiation tape and a high thermal conductive radiation tape article including the same. The present invention is used for an electronic appliance that requires slimness by thinning the radiation tape with high heat radiation. Furthermore, the high thermal conductive radiation tape and the high thermal conductive radiation tape article including the same according to the present invention features high heat conductivity as it conducts and disperses heat in both horizontal and vertical directions and efficiently discharges heat through small area.
申请公布号 KR101438397(B1) 申请公布日期 2014.09.17
申请号 KR20120113670 申请日期 2012.10.12
申请人 发明人
分类号 C09J7/02;F21V29/00;H05K7/20 主分类号 C09J7/02
代理机构 代理人
主权项
地址