A MULTILAYER CHEMICAL MECHANICAL POLISHING PAD WITH BROAD SPECTRUM, ENDPOINT DETECTION WINDOW

摘要

Provided is a multilayer chemical mechanical polishing pad which has a polishing layer which has a polishing surface, a counterbore opening part, and a polishing layer surface region parallel to the polishing surface; a porous sub pad layer which has a lower surface and a porous sub pad layer interface region parallel to the lower surface; and a broad spectrum endpoint detection window block including a ring-type olefin addition polymer part. The broad spectrum endpoint detection window block represents uniform chemical composition across the thickness. A polishing layer interface region and porous sub pad layer interface region form a coextensive region. A multilayer chemical mechanical polishing pad has a penetration opening part extended from the polishing surface to the lower surface of the porous sub pad layer. The counterbore opening part is open on the polishing surface and expands the penetration opening part to form a ledge. A window block is arranged in the counterbore opening part.