| 摘要 |
A surface-mounted device, a printed circuit board, and a printed circuit board assembly are provided to prevent thermal damage to an electronic part by improving a heating effect of a solder part without increase of a total temperature of a reflow soldering process. A surface-mounted device includes a device body(100) and a plurality of leads(110). The lead is protruded to an outer side of the device body. The lead is mat-finished by trivalent chrome or carbon black in order to absorb an infrared radiant heat during a reflow soldering. A solder contact surface of the lead is not mat-finished. A first mat-finished part(300) is formed around a land(210) of a printed circuit board(200). A second mat-finished part(310) is formed in a rear surface of the printed circuit board. The lead is mounted on the printed circuit board by a reflow soldering process. |
