3D-PACKAGES AND METHODS FOR FORMING THE SAME

摘要

A package includes an interposer, which includes: a first substrate which does not have through-vias therein; redistribution lines over the first substrate; and a plurality of first connectors electrically coupled to the redistribution lines on the redistribution lines. A first die is bonded to the first connectors by being located on the first connectors. The first die includes: a second substrate; and through-vias in the second substrate. A second die is bonded to the connectors by being located on the connectors. The first die and the second die are electrically coupled to each other by the redistribution lines. A plurality of second connectors is located on the first die and the second die. The second plurality of connectors is electrically coupled to the first connectors by the through-vias in the second substrate.