| 摘要 |
The present invention relates to a cutting mold device for manufacturing a heat-radiation pad which is used to manufacture the heat-radiation pad having a cushion pad with through-holes formed in the center thereof, a metal thin plate attached to one surface of the cushion pad, and metal thin plate incised portions formed by incising a portion of the metal thin plate to be passed through the through-holes and extended to the other surface of the cushion pad. According to the present invention, the cutting mold device includes a support mold having a flat support surface contacting the other surface of the cushion pad and punched holes formed on the support surface, a pressurizing mold disposed to face the support mold in such a manner as to become close to the support surface or become distant from the support surface, and cutting punches protruding from the pressurizing mold in such a manner as to be inserted into the punched holes of the support mold when the pressurizing mold becomes close to the support surface. If the pressurizing mold is ascended in the state where the cushion pad to which the metal thin plate is attached is located between the support mold and the pressurizing mold, the cutting punches pressurize the metal thin plate and sequentially enter the through-holes of the cushion pad and the punched holes of the support mold to allow the metal thin plate to be partially cut and at the same time to allow the metal thin plate incised portions to be bent toward the other surface of the cushion pad. |
