发明名称 |
Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus |
摘要 |
There is provided a solid-state image pickup device including a semiconductor substrate, and a plurality of pixel portions that are provided on the semiconductor substrate. Each of the pixel portions includes a photoelectric converting unit that generates a charge on the basis of incident light, a memory unit that accumulates the charge generated by the photoelectric converting unit, a light shielding portion that shields at least the memory unit from light, a digging portion that digs into the semiconductor substrate between the photoelectric converting unit and the memory unit and is formed of a light shielding material, and a transmitting unit that transmits the charge from the photoelectric converting unit to the memory unit, by forming a channel for transmission in the digging portion. |
申请公布号 |
US8835991(B2) |
申请公布日期 |
2014.09.16 |
申请号 |
US201313927863 |
申请日期 |
2013.06.26 |
申请人 |
Sony Corporation |
发明人 |
Arakawa Shinichi |
分类号 |
H01L31/00;H01L31/18;H01L27/148 |
主分类号 |
H01L31/00 |
代理机构 |
Sheridan Ross P.C. |
代理人 |
Sheridan Ross P.C. |
主权项 |
1. A solid-state image pickup device comprising:
a semiconductor substrate; and a plurality of pixel portions that are provided on the semiconductor substrate, wherein each of the pixel portions includes
a photoelectric converting unit that generates a charge on the basis of incident light,a memory unit that accumulates the charge generated by the photoelectric converting unit,a light shielding portion that shields at least the memory unit from light,a digging portion that digs into the semiconductor substrate between the photoelectric converting unit and the memory unit and is formed of a light shielding material, anda transmitting unit that transmits the charge from the photoelectric converting unit to the memory unit, by forming a channel for transmission in the digging portion. |
地址 |
JP |