Wafer transfer apparatus and wafer transfer method

摘要

A water transfer apparatus and a wafer transfer method are provided. The wafer transfer apparatus is provided with a heating component and a cooling component, the heating component heats the wafer carrying component to a temperature the same as the wafer when it is just unloaded from the rapid thermal anneal tool, and the cooling component cools the wafer carrying component along with the wafer to room temperature, thereby avoiding the large temperature difference between the wafer and the wafer transfer apparatus, preventing the high thermal stress induced inside the wafer during wafer transfer, avoiding wafer breakage, and ensuring the completeness of the wafer.

主权项

1. A wafer transfer method, comprising:
transferring a wafer unloaded from a rapid thermal anneal tool by a wafer transfer apparatus, the wafer being at a first temperature at the time when it is unloaded from the rapid thermal anneal tool, the wafer transfer apparatus comprising a wafer carrying component, a heating component and a cooling component, wherein
the heating component is adapted to heat the wafer carrying component to the first temperature, andthe cooling component is adapted to cool the wafer carrying component to room temperature; the method further comprising:
heating, by the heating component, the wafer carrying component to the first temperature prior to the transferring of the wafer;placing the wafer unloaded from the rapid thermal anneal tool directly on the wafer carrying component; andcooling, by the cooling component, the wafer carrying component and the wafer to room temperature.