| 摘要 |
The present invention provides a substrate processing apparatus which performs a process of reducing the warpage of a substrate. The substrate processing apparatus comprises a substrate stage for holding the substrate; a pressing member including a portion formed to press a peripheral portion of the substrate against the substrate stage; an obtaining unit configured to obtain information indicating a shift between the center of a region where a pattern is formed on the substrate and the center of the substrate; and a controller configured to control relative positions of the substrate stage and the pressing member based on the information obtained by the obtaining unit in order that the portion of the pressing member presses the peripheral portion of the substrate. |
