Circuit board with twinned CU circuit layer and method for manufacturing the same

摘要

A circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer on the surface of the substrate; (C) forming plural openings in the first dielectric layer, wherein each opening penetrates through the first dielectric layer and communicates with the conductive pad to expose the conductive pad; (D) forming a Cu seeding layer in the openings; (E) forming a nano-twinned Cu layer in the openings with an electroplating process; and (F) annealing the substrate to transfer the material of the Cu seeding layer into nano-twinned Cu, wherein the nano-twinned Cu layer and the transferred Cu seeding layer are formed into a second circuit layer.

主权项

1. A circuit board with twinned Cu circuit layer, comprising:
a substrate, which comprises at least a first circuit layer, and the first circuit layer comprises a conductive pad; a first dielectric layer, which is formed on a surface of the substrate, wherein the first dielectric layer comprises a plurality of openings adapted for exposing the conductive pad; and a second circuit layer, which is formed on the surface of the first dielectric layer, the second circuit layer comprises a plurality of first conductive vias, each of the first conductive vias is disposed in the opening so as to be electrically connected to the conductive pad, and the second circuit layer is made from nano-twinned Cu layer.