Implant encapsulation

摘要

An implant unit may include a substrate and an implantable circuit arranged on the substrate. An encapsulation structure may be disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including a parylene layer and a silicon layer disposed over the parylene layer.

主权项

1. An implantable device for treating sleep apnea, the device comprising:
a flexible substrate sized and shaped for supporting at least one pair of modulation electrodes and configured to lie between a myelohyoid muscle and a genioglossus muscle, the carrier further including a portion configured to lie between a geniohyoid muscle and the genioglossus muscle and configured to be implanted adjacent the genioglossus muscle; an implantable circuit arranged on the substrate and coupled to electrodes configured to stimulate a hypoglossal nerve; an encapsulation structure disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including: a first polymer layer having a first density; and a second polymer layer disposed over the first polymer layer and having a density which is less than the first density.