Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

摘要

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

主权项

1. A method for making a shielded electronic module comprising:
mounting at least one electronic component on a surface of a circuit board panel; mounting a plurality of shield components on the surface of the circuit board panel, each shield component including a conductive portion and a non-conductive portion, a portion of the conductive portion being in electrical contact with the surface of the circuit board panel and a portion of the non-conductive portion being in contact with the surface of the circuit board panel, top portions of the mounted shield components extending from the surface of the circuit board panel at least as high as a top portion of the at least one electronic component, and the mounted shield components providing an electromagnetic shield for the at least one electronic component; and sawing the non-conductive portion of one or more of the mounted shield components.