发明名称 FINGERPRINT SENSING MODULE AND METHOD OF MANUFACTURING THEREOF
摘要 The present invention relates to a fingerprint recognition module comprising a support protrusion capable of determining thickness of a resin layer of the present invention and a manufacturing method thereof. According to the present invention, a manufacturing process is simple and yield can be increased while increasing the recognition rate because a distance between a sensor part and a surface contacting with a fingerprint to be recognized is short. The fingerprint recognition module of the present invention includes a body including a lower part and an upper part combined with the lower part; a sensor part combined with the body; and a resin layer combined with the sensor part. The lower part comprises a mounting part where the sensor part is mounted, and the upper part comprises an aperture part where the mounting part is inserted. A top surface of the upper part is polished, and the sensor part is combined with one plane of the mounting part and has at least one support protrusion on the surface. An end part of the support protrusion is formed to reach the surface of the resin layer, and a top surface of the resin layer is formed on the same plane as the top surface of the upper part.
申请公布号 KR20140109584(A) 申请公布日期 2014.09.16
申请号 KR20130023674 申请日期 2013.03.06
申请人 PARTRON CO., LTD. 发明人 LEE, SU KIL;SONG, YOUNG HWAN
分类号 G06K9/00;G06K9/20 主分类号 G06K9/00
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