发明名称 Method for manufacturing liquid crystal display device and liquid crystal display device
摘要 The present invention provides a method for manufacturing a liquid crystal display device and a liquid crystal display device. The method includes (1) preparing a TFT substrate and a CF substrate; (2) applying sealant resin to the TFT substrate or CF substrate to form an enclosing resin frame body that forms an entry opening on the CF substrate or the TFT substrate; (3) applying sealant resin to the entry opening of the enclosing resin frame body to form a closing section; (4) filling liquid crystal inside the enclosing resin frame body; (5) bonding the TFT substrate and the CF substrate together; and (6) subjecting the bonded TFT substrate and the CF substrate to curing at high temperature in order to cure the enclosing resin frame body.
申请公布号 US8836905(B2) 申请公布日期 2014.09.16
申请号 US201213520172 申请日期 2012.05.18
申请人 Shenzhen China Star Optoelectronics Technology Co., Ltd. 发明人 Lee Kuancheng;Li Chihhsien
分类号 G02F1/1339 主分类号 G02F1/1339
代理机构 代理人 Chiang Cheng-Ju
主权项 1. A method for manufacturing a liquid crystal display device, comprising the following steps: (1) preparing a thin film transistor (TFT) substrate and a color filter (CF) substrate; (2) selecting one of sides of the CF substrate or the TFT substrate as a starting side and applying sealant resin from an edge of the starting side in an inward curving manner and continuing the application to the remaining ones of the sides in a sequential manner to circle back to the starting side, where the application is made in an outward curving manner to reach the starting edge and oppose the starting end of the sealant resin, whereby the sealant resin forms an enclosing resin frame body that forms an entry opening on the CF substrate or the TFT substrate; (3) applying sealant resin to the entry opening of the enclosing resin frame body to form a closing section; (4) filling liquid crystal inside the enclosing resin frame body; (5) bonding the TFT substrate and the CF substrate together; and (6) subjecting the bonded TFT substrate and the CF substrate to curing at high temperature in order to cure the enclosing resin frame body; wherein the closing section is spaced from the starting edge by 200 mm-500 mm.
地址 Shenzhen, Guangdong Province CN