Integrated flex tail circuit packaging

摘要

An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.

主权项

1. An integrated structure, comprising:
a logic board; a plurality of integrated circuits mounted on or in the logic board; a through mold via (TMV) module mounted on or in the logic board, the TMV module comprising:
a substrate;at least one component coupled to the substrate;a body encapsulating the at least one component; andone or more vias that extend all of the way through the substrate and the body; and a flexible printed circuit board (flex-PCB) directly coupled to the substrate of the TMV module, wherein the one or more vias provide an interconnection between the at least one component, the flexible printed circuit board, and at least some of the integrated circuits in the plurality of integrated circuits.