发明名称 Removable airflow guide assembly with a processor air cooler and memory bank coolers
摘要 Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.
申请公布号 US8837138(B2) 申请公布日期 2014.09.16
申请号 US201213406335 申请日期 2012.02.27
申请人 Hewlett-Packard Development Company, L.P. 发明人 Wiltzius Andrew L.;Searby Tom J;Crane Robert Lee;Gomez Adolfo Adolfo
分类号 G06F1/20;H05K5/00;H05K7/20;H02B1/01 主分类号 G06F1/20
代理机构 代理人 Pinkston Caroline
主权项 1. A removable airflow guide assembly for a computing device comprising: a processor air cooler to direct air over a processor positioned on a circuit board, the circuit board within a chassis and the processor air cooler is not directly aligned over the processor; memory bank coolers to direct air over memory banks positioned on the circuit board, each memory bank cooler aligned directly over each memory bank; and a connector socket to align with the circuit board, the connection to provide power to the processor air cooler and the memory bank coolers, wherein the processor air cooler, the memory bank coolers, and the connector socket are attached on the removable airflow guide assembly.
地址 Houston TX US