| 发明名称 | Bonding structure of multilayer copper bonding wire | ||
| 摘要 | A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion. | ||
| 申请公布号 | US8836147(B2) | 申请公布日期 | 2014.09.16 |
| 申请号 | US201113877224 | 申请日期 | 2011.09.29 |
| 申请人 | Nippon Steel & Sumikin Materials Co., Ltd. | 发明人 | Uno Tomohiro;Yamada Takashi;Ikeda Atsuo |
| 分类号 | H01L23/48;H01L25/065;B23K20/00;H01L23/00;H01B1/02 | 主分类号 | H01L23/48 |
| 代理机构 | Troutman Sanders LLP | 代理人 | Troutman Sanders LLP |
| 主权项 | 1. A bonding structure of a ball-bonded portion obtained by bonding to a bonding-target portion a ball portion formed on a front end of a multilayer copper bonding wire, wherein said multilayer copper bonding wire comprises: a core member mainly composed of copper; andan outer layer formed on said core member and mainly composed of at least one noble metal selected from the group of Pd, Au, Ag and Pt, wherein said bonding structure comprises a first concentrated portion having a high total noble metal level and being formed in a ball-root region, said ball-root region being in such a surface region of said ball-bonded portion as is located at a boundary with said multilayer copper bonding wire, wherein said high total noble metal level accounts for all of said noble metals selected, and wherein a total concentration of said at least one noble metal selected in said first concentrated portion is not lower than 0.05 mol % and not higher than 6 mol %. | ||
| 地址 | Tokyo JP | ||