Method for producing a two-chip assembly and corresponding two-chip assembly

摘要

A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

主权项

1. A method for producing a two-chip assembly, comprising:
providing a wafer having a first thickness, a front side, and a back side, a first plurality of first chips being provided as part of the wafer; mounting a second plurality of second chips on the front side of the wafer so that every first chip is joined in each instance to a corresponding second chip and forms a corresponding two-chip pair; forming a cohesive one-sided mold package on the front side of the wafer so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming multiple vias and electrical connections from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.