| 发明名称 | Circuit board assembly and method of assembling circuit boards | ||
| 摘要 | According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other. | ||
| 申请公布号 | US8835774(B2) | 申请公布日期 | 2014.09.16 |
| 申请号 | US201113283824 | 申请日期 | 2011.10.28 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Kim Hyun-seok;Suh Inh-seok;Kim Tak-kyoum |
| 分类号 | H05K1/16;H05K1/11 | 主分类号 | H05K1/16 |
| 代理机构 | Drinker Biddle & Reath LLP | 代理人 | Drinker Biddle & Reath LLP |
| 主权项 | 1. A circuit board assembly comprising: a first circuit board comprising a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board comprising a second circuit pattern aligned with the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit pattern is formed outside a projected periphery of the opening, and the second circuit pattern is formed outside the hollow place, wherein at least one of the first circuit board and the second circuit board is a flexible circuit board; and wherein the first circuit board and the second circuit board are combined with each other to electrically connect the first circuit pattern with the second circuit pattern. | ||
| 地址 | Suwon-Si KR | ||