发明名称 Linear motion guide device
摘要 In a linear motion guide device suitably applicable to applications under high-temperature and vacuum environments where no plastic end cap is applicable, and having an end cap formed by injection molding using metal powders as a raw material, the degree of adhesion of the metal powders is improved at a thin and keen portion like the scooping portion of the end cap, thereby suppressing an abrasion and a deformation. The end cap (7) is formed by injection molding (MIM: Metal Injection Molding) using metal powders of equal to or less than 20 μm as a raw material, and has a scooping portion (9) having undergone an HIP (Hot-Isostatic-Pressing) process and a thermal process.
申请公布号 US8834025(B2) 申请公布日期 2014.09.16
申请号 US201214111067 申请日期 2012.02.20
申请人 NSK Ltd. 发明人 Kato Soichiro;Sato Ryoichi
分类号 F16C29/06;F16C33/64;F16C33/62 主分类号 F16C29/06
代理机构 Crowell & Moring LLP 代理人 Crowell & Moring LLP
主权项 1. A linear motion guide device comprising: a guide rail including a rolling element rolling groove formed in an outer side face; a slider including a rolling element rolling groove formed in an internal side face so as to face the rolling element rolling groove of the guide rail, the slider being provided in a slidable manner through a plurality of rolling elements loaded in a load raceway formed by the rolling element rolling grooves facing with each other; and a pair of end caps disposed at both ends of the slider so as to form an endless circulation channel for the plurality of rolling elements, wherein: the slider comprises a rolling element return channel along the load raceway, the rolling element return channel forming the endless circulation channel; the end cap comprises a scooping portion that scoops the rolling elements rolling over the load raceway, and a direction change channel that interconnects the load raceway with the rolling element return channel, the scooping portion and the direction change channel forming the endless circulation channel; the end caps are each formed by injection molding using metal powders having a particle diameter of equal to or less than 20 μm as a raw material; and the scooping portion is subjected to an HIP process and a thermal process.
地址 Tokyo JP