Circuit board structure and package structure

摘要

A circuit board structure, a packaging structure and a method for making the same are disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

主权项

1. A circuit board structure, comprising:
a carrier; a release film attached to said carrier; a patterned solder mask inlaid into said release film; a die pad in direct contact with said patterned solder mask; a first conductive pattern disposed on said release film and in direct contact with said release film; a second conductive pattern disposed on said release film, adjacent to said first conductive pattern and in direct contact with said patterned solder mask; a covering solder mask selectively covering and surrounding said second conductive pattern; and a protective layer covering said first conductive pattern, wherein said patterned solder mask only covers a bottom surface of said second conductive pattern and a bottom surface of said die pad.