发明名称 Power/performance optimization through temperature/voltage control
摘要 A method of optimizing power and timing for an integrated circuit (IC) chip, identifies a plurality of valid temperature and voltage combinations that allow integrated circuit chips produced according to the integrated circuit chip design to operate within average power consumption goals and timing delay goals. Such a method selects temperature cut points from the valid temperature and voltage combinations for each of the integrated circuit chips, calculates a power consumption amount of each of the temperature cut points, and adjusts the temperature cut points based on the power consumption amount until the temperature cut points achieve the average power consumption goals. Next, this method tests each of the integrated circuit chips, and records the temperature cut points in the memory of the integrated circuit chips.
申请公布号 US8839170(B2) 申请公布日期 2014.09.16
申请号 US201313749851 申请日期 2013.01.25
申请人 International Business Machines Corporation 发明人 Bickford Jeanne P.;Foreman Eric A.;Kuemerle Mark W.;Lichtensteiger Susan K.
分类号 G06F17/50;G01R31/317 主分类号 G06F17/50
代理机构 Gibb & Riley, LLC 代理人 Gibb & Riley, LLC
主权项 1. A method comprising: inputting average power consumption goals and timing delay goals for an integrated circuit chip design into a computerized device; identifying a plurality of valid temperature and voltage combinations that allow integrated circuit chips produced according to said integrated circuit chip design to operate within said average power consumption goals and said timing delay goals, using said computerized device; selecting temperature cut points from said valid temperature and voltage combinations for each of said integrated circuit chips using said computerized device; calculating a power consumption amount of each of said temperature cut points using said computerized device; adjusting said temperature cut points based on said calculating of said power consumption amount until said temperature cut points achieve said average power consumption goals; testing each of said integrated circuit chips using testing equipment operatively connected to said computerized device; recording in memory of said integrated circuit chips said temperature cut points; and calculating an average system power, using said computerized device, based on said testing and said power consumption amount of each of said temperature cut points.
地址 Armonk NY US