| 发明名称 | Electronic component and method of manufacturing electronic component | ||
| 摘要 | A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin. | ||
| 申请公布号 | US8837149(B2) | 申请公布日期 | 2014.09.16 |
| 申请号 | US201113307029 | 申请日期 | 2011.11.30 |
| 申请人 | Fujitsu Limited | 发明人 | Hirose Shinichi;Iwai Taisuke;Yamaguchi Yoshitaka;Yagishita Yohei;Sakita Yukie;Norimatsu Masaaki |
| 分类号 | H05K7/20;H01L21/50;H01L21/48;H01L23/433;H01L23/42;H01L23/373 | 主分类号 | H05K7/20 |
| 代理机构 | Fujitsu Patent Center | 代理人 | Fujitsu Patent Center |
| 主权项 | 1. A method of manufacturing an electronic component comprising: disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate; disposing a blotting paper above the heat radiation material; making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper; removing the blotting paper; and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin. | ||
| 地址 | Kawasaki JP | ||