Flexible electronic devices and related methods

摘要

A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.

主权项

1. A method for fabricating a packaged electronic device, the method comprising:
forming a plurality of electrical conductors on a first structural layer; depositing an attachment layer on the electrical conductors and the first structural layer; placing a die including die circuitry on the attachment layer to bond the die to the first structural layer; forming a plurality of interconnects extending from the die circuitry, through the die, through the attachment layer, and into contact with respective electrical conductors; depositing a second structural layer on the die and exposed portions of the electrical conductors, wherein the first structural layer and the second structural layer encapsulate the die, the die circuitry and the electrical conductors; and forming a plurality of openings through at least one of the first structural layer and the second structural layer to expose respective areas of the electrical conductors.