发明名称 Low extension dose implants in SRAM fabrication
摘要 A static random access memory fabrication array includes at least one p-type field effect transistor, including a gate stack and isolating spacers forming a gate having a gate length Lgate and an effective gate length, Leff and a source and drain region adjacent the gate stack, wherein the source and drain regions are formed from a low extension dose implant that decreases a difference between Lgate and Leff.
申请公布号 US8835997(B2) 申请公布日期 2014.09.16
申请号 US201213464267 申请日期 2012.05.04
申请人 International Business Machines Corporation 发明人 Chang Leland;Lin Chung-Hsun;Lo Shih-Hsien;Sleight Jeffrey W.
分类号 H01L29/78 主分类号 H01L29/78
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Alexanian Vazken
主权项 1. A static random access memory (SRAM) array, comprising: at least one p-type field effect transistor, including: a first gate stack having a first gate dielectric layer having a width, and isolating spacers forming a first gate having a gate length, Lgate and an effective gate length, Leff; and a first source region and first drain region adjacent the first gate stack, wherein the first source and first drain regions are formed from a low extension dose implant performed at a dose between 1×1010 atoms/cm2 to 1×1013 atoms/cm2 that decreases a difference between Lgate and Leff, such that the first source and first drain regions underlap only the isolating spacers, and that Leff is greater than the width of the first gate dielectric layer, as a result of the low extension dose implant; and at least one n-type field effect transistor, including: a second gate stack having a second gate dielectric layer having the width, and isolating spacers forming a second gate having the gate length, L gate and an second effective gate length; and a second source region and second drain region adjacent the second gate stack, wherein the second source and second drain regions are formed from a high extension dose implant performed at a dose between 1×1015 and 5×1015 atoms/cm2, such that the second source and second drain regions underlap the isolating spacers and the second gate stack, and that the second effective gate length is less than the width of the second gate dielectric layer, as a result of the high extension dose implant, wherein the p-type field effect transistor has a higher resistance than the n-type field effect transistor.
地址 Armonk NY US