发明名称 LED module
摘要 An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.
申请公布号 US8835942(B2) 申请公布日期 2014.09.16
申请号 US201113032755 申请日期 2011.02.23
申请人 Lite-On Electronics (Guangzhou) Limited;Lite-On Technology Corp. 发明人 Chen Chen-Yu;Lu Yu-Kang;Wang Yan-Yu
分类号 H01L33/08;F21K99/00;H01L33/48;F21Y105/00;F21Y101/02;H01L33/62 主分类号 H01L33/08
代理机构 Rosenberg, Klein & Lee 代理人 Rosenberg, Klein & Lee
主权项 1. A reconfigurable LED module system, comprising: a plurality of LED package units each having a submount; a plurality of first engaging portions and a plurality of first conductive portions disposed on said submount; at least one LED chip positioned on said submount, said submount of each of said LED package units being a multilayer structure and including a top layer and a bottom layer; a top surface of said bottom layer being provided with a chip-mounting area for mounting of said LED chip thereon, said top layer being disposed above said bottom layer and having a cavity for exposure of said LED chip which is mounted on said chip-mounting area, said first conductive portions being provided on said top surface of said bottom layer, being spaced apart from each other, surrounding said chip-mounting area, at least two of said first conductive portions being exposed via said cavity for electrical connection with said LED chip, each of said first conductive portions having at least one portion connected to a corresponding one of said first engaging portions; and at least one connecting unit having a first main body, at least two second engaging portions disposed on said first main body, and at least one second conductive portion having two opposite end sections extending respectively to said second engaging portions; wherein said second engaging portions engage with corresponding ones of said first engaging portions of two of said LED package units, and said two end sections of said second conductive portion of said connecting unit contact corresponding ones of said first conductive portions of said two LED package units so that said LED package units can be interconnected through said connecting unit and said LED chips of said LED package units can be electrically connected.
地址 Guangzhou CN