Preparation method for an electroconductive patterned copper layer

摘要

A method for preparing an electroconductive patterned copper layer, comprising mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution; printing on or filling in the reducing agent-containing copper-based particle dispersion solution a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and firing the reducing agent-containing copper-based particle patterned layer in the air, which allows forming a patterned copper layer with excellent electric conductivity even in the air, thereby being industrially very useful.

主权项

1. A method for preparing an electroconductive patterned copper layer, the method comprising:
(a) mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution consisting of the copper-based particles, the reducing agent, and the solvent; (b) printing on or filling in the reducing agent-containing copper-based particle dispersion solution on a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and (c) firing the reducing agent-containing copper-based particle patterned layer in air, not in an inert gas atmosphere, wherein the reducing agent is included in the content of 0.1 to 80 parts by weight, based on 100 parts by weight of the reducing agent-containing copper-based particle dispersion solution, wherein the copper-based particles are cuprous oxide particles or mixtures of copper particles and cuprous oxide particles, wherein the reducing agent added to the copper-based particles dispersion solution reduces cuprous oxide into copper when the copper-based particle patterned layer is fired in the air, thereby continuously supplying copper at an initial firing stage, wherein the copper is fired faster due to the oxygen in the air than the speed at which copper is oxidized, thereby forming the electroconductive patterned copper layer in the air, and wherein the firing is a thermal treatment process performed at 200 to 650° C.