发明名称 |
Method of making bondable printed wiring member |
摘要 |
A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes the steps of a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member using an electroless nickel deposition process; e) depositing a gold layer on the nickel coating using an electroless gold deposition process; and f) depositing palladium on the gold layer using an electroless palladium deposition process to improve wear resistance of the connector pads while preserving bondability of the contact pads. |
申请公布号 |
US8834729(B2) |
申请公布日期 |
2014.09.16 |
申请号 |
US200912627161 |
申请日期 |
2009.11.30 |
申请人 |
Eastman Kodak Company |
发明人 |
Chen Samuel;Levey Charles I. |
分类号 |
G01D15/00;G11B5/127;H01L21/82;H01L21/302;H01L21/461;H05K3/24;H05K1/03 |
主分类号 |
G01D15/00 |
代理机构 |
|
代理人 |
Watkins Peyton C. |
主权项 |
1. A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method comprising the steps of:
a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on contact pads and connector pads of the patterned printed wiring member using an electroless nickel deposition process; e) depositing a gold layer on the nickel coating on the contact pads and connector pads at the same time using an electroless gold deposition process; and f) depositing palladium on the gold layer using an electroless palladium deposition process to improve wear resistance of the connector pads while preserving bondability of the contact pads. |
地址 |
Rochester NY US |