Method of fabricating a semiconductor test probe head

摘要

A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

主权项

1. A method for fabricating a semiconductor test probe head comprising:
providing a workpiece made of an electrically conductive material; cutting a plurality of first channels in the workpiece in a first axial direction using an electric discharge wire; cutting a plurality of second channels in the workpiece in a second axial direction using the electric discharge wire, the first and second channels intersecting and forming a plurality of a pillars defining testing probes at the intersections between the first and second channels, wherein the pillars are supported and cantilevered from a common support base formed integrally with the pillars from the workpiece during cutting the first and second channels; connecting the testing probes to electrical conductors formed in a support substrate, the testing probes and the support substrate defining a testing probe head, and severing the common support base from the testing probes after connecting the testing probes to the electrical conductors in the support substrate.