Method of final defect inspection

摘要

Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

主权项

1. A method of final defect inspection, comprising steps of:
preparing a final defect inspection apparatus, which comprises a host device having a database, a microscope, a bar code scanner electrically connected to the host device, a support tool for supporting a circuit board to be inspected, a signal transceiver provided on the support tool and electrically connected to the host device, and an electromagnetic pen; scanning a bar code on the circuit board by using the bar code scanner, wherein the host device selects data and a circuit layout diagram from the database corresponding to the bar code; calibrating an original point by using the electromagnetic pen to scribe a diagonal line on the circuit board so as to generate a plurality of original mark positions, wherein the signal transceiver receives and transmits the original mark positions to the host device such that the host device defines an outline of the circuit board based on the original mark positions and the circuit layout diagram, and specifies one point on the circuit board as the original point; inspecting any defect by disposing the support tool provided with the circuit board and the signal transceiver on a support plate of the microscope, moving the support plate and using an eye lens and at least one object lens of the microscope to inspect whether any defect exists in a plurality of inspection regions preset on the circuit board, wherein a defect position is the inspection region where any defect is found is specified; marking the defect by using the electromagnet pen to make a mark on each defect position, wherein the signal transceiver receives and transmits each defect position to the host device; and generating a shipment file by using the host device, which calculates each coordinate of a scrap region based on a relative position between the original point and each defect position, and then generates a shipment file containing each coordinate of the scrap region.